Latest Stories
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Zebra Data Reveals Top Automation Motives, Labour Challenges in Warehousing
Zebra Technologies has announced their new Automation, Augmentation and Labour Planning report. It includes data revealing the top challenges driving warehousing leaders toward automation and other technology investments and how they could…
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STMicroelectronics Expands into 3D Depth Sensing with Latest Time-of-Flight Sensors
STMicroelectronics have announced an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection And Ranging) module with market-leading 2.3k resolution, and revealed an early design win for the world’s smallest 500k-pixel…
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ABB Identifies New Frontiers for Robotics and AI in 2024
Marc Segura, President of the ABB Robotics Division, identifies three drivers for robotics-driven AI solutions in 2024, as ABB continues expansion in new segments not previously served by robotic automation.…
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Teledyne DALSA: Computer Vision and AI are a Perfect Match For Intelligent Traffic Systems
Computer vision and artificial intelligence (AI) each have their purpose in modern vision systems. When developing an imaging platform, certain challenges may arise when trying to implement AI in an…
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The SICK W10 Swipe-and-Set-up Touchscreen Sensor is a World First
SICK has unveiled the world’s first photoelectric sensor with a touchscreen display, heralding the future for universal and easy-set-up sensing. The pioneering SICK W10 is a versatile all-in-one sensor that…
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Nisshinbo Unveils NA7200BE Series 3-Phase BLDC Motor Controller IC
Nisshinbo Micro Devices Inc. has launched the NA7200BE series 3-Phase BLDC Motor Controller IC intended for general purposes such as fans and other small BLDC motors. The versatile NA7200BE offers…
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Comau and Leonardo: AI and Advanced Robotics Serving the Aerospace Industry
Comau and Leonardo are leveraging cognitive robotics, to deliver advanced automated inspection for mission-critical aeronautical structures. The increasing push for faster processes, better control and higher quality in the aerospace…
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EXCLUSIVE: Revealing the Plans for VISION 2024 at Messe Stuttgart
In this exclusive interview with MVPro Media for the latest issue of MVPro Magazine, Florian Niethammer, Head of Exhibitions and Events at Messe Stuttgart, reveals the early plans For VISION…
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IDTechEx Discusses Advanced Semiconductor Packaging Trends in AI and HPC
Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI…
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Choosing Your Path with FRAMOS: Navigating Optical Image Sensor Module Complexities
FRAMOS has announced a free webinar “Build vs Buy: Navigating Optical Image Sensor Module Complexities” hosted by Edge Ai & Vision Alliance. This webinar represents a significant milestone for the company…
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Latest Issue of MVPro Magazine
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Light | MVPro 45 | July/August 2025
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Welcome Welcome to the latest issue of MV Pro Media Magazine. This issue we head in to the summer break…
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