Teledyne Vision Solutions will showcase the world’s most comprehensive, vertically integrated portfolio of industrial and scientific imaging technology at VISION in Messe Stuttgart.
Whether you are designing systems for semiconductor, battery, or print inspection, developing next-generation robots, or deploying advanced systems from food processing to warehouse logistics, Teledyne Vision Solutions can provide for unlimited vision solutions.
Those who visit Teledyne’s booth will see its wide range of cameras and sensors, including the latest high-performance line scan cameras, contact image sensors, area scan cameras, stereo cameras, smart cameras with advanced connectivity, and the latest innovations in global shutter BSI and SWIR sensors.
Teledyne will also highlight its advanced CMOS sensor platforms, including new-generation products and our latest imaging modules. Take in the breadth of its 3D laser profilers, plus its compact and low-power uncooled thermal camera platform, featuring the smallest VGA IR core module on the market.
Visit the Teledyne Vision Solutions booth (8B10) and explore the latest technology from Teledyne’s DALSA, e2v, FLIR, Lumenera, and Adimec businesses.
