TDK’s Next-Gen Ultrasonic ToF Sensor Enables New Mass Market Applications in IoT and Robotics

by | May 10, 2024

TDK InvenSense ICU-10201

TDK Corporation announces full distribution availability of its InvenSense SmartSonic™ ICU-10201 ultrasonic time-of-flight (ToF) sensor with on-chip processing, enabling the design of high-performance, low-power IoT and robotics products.

The ICU-10201 sensor offers the sensitivity required for accurate obstacle avoidance or proximity sensing, which is used frequently in robotics, drones, and robot vacuum cleaner (RVC) devices. It is also highly relevant for products that require level sensing, such as in a liquid dispenser or coffee machine.

Key features and advantages of the ICU-10201 ultrasonic ToF sensor include:

  • Ultra-low power consumption in a miniature package: The SmartSonic family of ToF sensors integrate a MEMS piezoelectric micromachined ultrasonic transducer (PMUT) with a low-power system on chip (SoC) in an ultra-compact reflowable package.
  • Enhanced on-chip processing capabilities: The ICU-10201 embeds a powerful on-chip processor with higher computational power than previous solutions. Its enhanced processing capabilities allow fitting and running a wide range of application algorithms on-chip, offloading the system MCU completely.
  • High sensitivity: Based on ultrasonic pulse-echo or pitch-catch measurements, the ToF sensor provides millimetre-accurate and robust range measurements to targets at distances up to 1.7m, in any lighting condition including full sunlight, independently of the target’s colour and optical transparency, like glass walls or mirrors.

“Our ICU-10201 allows the design of smarter low-power solutions, making the final product greener, safer, and more aware of surrounding environments,” said Massimo Mascotto, Director of Product Marketing, InvenSense, a TDK group company. “The sensor’s improved on-chip processing has greater computing power in a miniature package, which enables smarter products for our customers and partners.”

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