DIVE Imaging Systems is transforming industrial inspection with its cutting-edge Hyperspectral Vision systems, designed to deliver unparalleled accuracy for wafer inspection and thin-film applications. Leveraging Specim’s hyperspectral cameras, DIVE’s fully integrated solution—comprising hardware and software—brings advanced, non-invasive inspection capabilities to the semiconductor industry and beyond. Dr. Philipp Wollmann, CEO of DIVE, emphasizes, “Our goal is to provide a comprehensive, hyperspectral solution for industrial inspection, empowering manufacturers to achieve exceptional surface analysis and thickness measurements with AI-driven precision.”
Hyperspectral imaging merges spectral analysis with high-resolution imaging, allowing for a 100% inspection of wafer surfaces. This holistic view detects layer thickness variations, contamination, and defects with unmatched clarity, offering complete area coverage that replaces outdated sampling methods. By inspecting production wafers directly, manufacturers benefit from reduced defects, resource savings, and faster inspection times—processing a 300 mm wafer in just 30 seconds. The Specim FX10 and Specim FX17 cameras play a vital role in enhancing DIVE’s system with their cutting-edge imaging quality, robust design, GigE connectivity, and compact size for seamless integration.
The benefits of hyperspectral imaging extend beyond semiconductors, impacting electronics, optics, and other industries where precise layer inspection is critical. DIVE’s Hyperspectral Vision system enables a higher quality output, contributing to zero-defect manufacturing and increased production efficiency.
With this technology, DIVE sets a new standard in wafer inspection, combining machine learning and AI with chemical-analytical methods to discover innovative approaches to quality assessment. Dr. Wollmann states, “Hyperspectral vision is a game-changer for industrial inspection, capturing detailed data for improved quality control across diverse applications.”
About Specim
Specim is a global leader in hyperspectral imaging solutions, offering cameras that cover the VNIR, NIR, SWIR, MWIR, and LWIR ranges, along with comprehensive software and accessories to serve a wide range of industrial and scientific markets. Specim is a part of the Konica Minolta Group.
About DIVE Imaging Systems
DIVE Imaging Systems GmbH manufactures innovative surface and layer inspection tools in semiconductor production. The hyperspectral vision systems make it possible to visualize hidden features of surfaces and layers. By integrating high-resolution imaging with AI-driven insights, DIVE enables precise, non-invasive quality control that supports zero-defect manufacturing and increased production efficiency.
