AMD has bolstered its embedded portfolio with new Ryzen Embedded 5000 Series processors for networking solutions. “Zen 3” powered Ryzen Embedded family offers mid-range scalable performance solution for space-and power-constrained networking applications.

The AMD Ryzen Embedded 5000 Series is a new solution for customers requiring power-efficient processors optimised for “always on” networking firewalls, network-attached storage systems and other security applications. It rounds out the “Zen 3”-based AMD embedded processor portfolio, including the Ryzen Embedded V3000 and EPYC™ Embedded 7000 series families.

Built on 7nm technology with planned five-year manufacturing availability, and equipped with 6, 8, 12 or 16 cores and 24 lanes of PCIe® Gen4 connectivity, they are designed for enterprise reliability to support the consistent uptime requirements needed by security and networking customers. The processors include robust reliability, availability and serviceability (RAS) features, including an ECC-supported memory subsystem. With a thermal design power (TDP) profile ranging from 65W to 105W, Ryzen Embedded 5000 processors enable the reduction of overall system cooling footprint for space-constrained and cost-sensitive applications.

“Ryzen Embedded 5000 processors deliver the ideal combination of performance and reliability required for 24×7 security and networking applications,” said Rajneesh Gaur, corporate vice president & general manager, Embedded Solutions Group, AMD. “This expansion of our embedded product portfolio offers a mid-range solution that fills the gap between our low-power BGA Ryzen Embedded and our world-class EPYC embedded family for customers requiring both high performance and scalability of up to 16 cores.”

“AMD’s success in the embedded market is built on offering differentiated and scalable offerings that address a wide range of applications with different power, performance and environmental requirements,” said Kevin Krewell, principal analyst at TIRIAS Research. “The AMD Ryzen Embedded 5000 strikes an optimal balance of power and performance for applications ranging from small-form factor embedded systems to storage, security, and networking systems, suiting the broadest range of customers and use cases.”

These processors offer:

  • Scalability up to 16 cores and 32 threads
  • Up to 64MB of shared L3 CPU Cache
  • Energy efficient TDP from 65W to 105W
  • ECC-supported memory and security features
  • 24 lanes of PCIe® 4 connectivity (expandable I/O up to 36 lanes with AMD X570 chipset)
  • Optimized performance for enterprise reliability

Ryzen Embedded 5000 Series Processor Product Chart

Ryzen Embedded 5000 Series Processor Product Chart

1- Max boost for Ryzen Embedded 5000 processors is the maximum frequency achievable by any single core on the processor under normal operating conditions for enterprise systems.

2 – Ryzen Embedded 5800E processor supports configurable Thermal Design Power (cTDP) from 65W to 100W.

3 – Ryzen Embedded 5000 processors support a total of 24 lanes of PCIe® Gen4. Optionally paired with the AMD X570 Chipset, up to 36 lanes of PCIe® Gen4 can be supported.

 

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